Open Standard Ruggedization Kits from WaveTherm

Requested Data for Heatframe Design/Analysis

Board Manufacturer’s Part Number And Description

Detailed BOM with mfg. part numbers and ref designators for pcb layout.

PCB layout, DXF and / or IDF with reference designators (Note: components should be consistently identified using the same designation or acronym)

Power dissipation spread sheet listing all critical or vulnerable components (typically >1w or heat flux > 1w/in²)

  • Power dissipation calculations for entire board
  • On-board power supply (if used) calculations and specifications

Manufacturer’s specification sheets for the following:

  • All high wattage components
  • All temperature sensitive devices
  • All components with a height greater than .080”

All relevant design requirements are defined according to a general SOW

  •  VME, IEEE, PICMG etc.
  • Mil specs
  • Environmental specs
  • NASA specs
  • Others

Additional Information and Materials If Possible

  • Sample board if available
  • Spec sheets organized in individual folders by manufacturer
  • Relevant CAD models of the PCB

Submitting Data Pack

Email to SALES@WAVETHERM.COM

Wedgelock Orientation

"PS" Part numbers

Primary Side

Heat Exchange Drawing

"ss" Part Numbers

Secondary Side

Heat Exchange Drawing

"Pt" Part Numbers

Pass Through

Heat Exchange Drawing
  • 3U VPX Developement Kit for Vita 48.2 160mm, ruggedized metal enclosure for embedded computer board

    None

    NO MEZZANINE CARD

  • Vita 48.2 3U VPX Development Kit (160mm Thick PCB), ruggedized metal enclosure for embedded computer board

    FMC

    FPGA MEZZANINE CARD

  • 3U VPX Developement Kit for Vita 48.2 160mm, ruggedized metal enclosure for embedded computer board

    PMC

    PMC or XMC MEZZANINE CARD

  • 3U VPX Developement Kit for Vita 48.2 160mm, ruggedized metal enclosure for embedded computer board

    PERIMETER

    PERIMETER ONLY FRAME

Frequently Asked Questions

General Information

What's included in a delivered assembly from WaveTherm?

Full BOM except for PCB and electronics.

Machined heatframe components, thermal interface materials cut to size, wedgelocks, injector-ejectors, and mounting hardware.

Materials

Material specifications can be found on the data sheet for each OpenCOTS module. To locate a data sheet for your product, search the part number or name in the website search bar and click the datasheet button on the product page.

PCB Reference Drawings

PCB reference drawings specifications can be found on the product page for each OpenCOTS module. To locate a drawing for your product, search the part number or name in the website search bar and click the PCB Drawing button on the product page.

VPX Information

Overview and History

The VPX base standard defined in VITA 46 is a scalable backplane technology designed specifically for high speed, critical embedded systems.

The VITA 46 working group was first launched in 2003. At that time VMEbus systems (first introduced in 1981) were in wide use.

The VPX specification was extended in VITA 48 (VITA REDI, ruggedized enhanced design implementation) to support the increased operating power of high -density electronic modules by defining the mechanical design requirements to support enhanced cooling methods. VPX REDI also sets standards for the use of ESD covers on both sides of boards. WaveTherm provides engineered products & services that meet the VPX REDI (VITA 48) standard.

OpenVPX (VITA 65) is a system-level VPX specification designed to address interoperability between VPX boards and backplanes from multiple vendors. It was ratified in 2010.

Additional VITA standards have been ratified to support specific types of connectivity and other issues, and new VITA standards are still being actively worked on by their respective VITA
committees.

For a complete history of these VITA standards see https://www.VITA.Com/history.

Applications

Military Applications:
Air / Land / Sea / Space

Mobile Commercial
Transport Industry
Machine Industrial Control
Outdoor Telecom
Edge And Customer Premise
Equipment
Medical
Enterprise And Data
Digital Imaging

Environmental Classifications

Vibration Class V1
1 Hour Per Axis:
5 Hz To 100 Hz Psd = 0.04 G2/hz

Vibration Class V2
1 Hour Per Axis:
5 Hz To 100 Hz Psd Increasing At 3 Db/octave
100 Hz To 1000 Hz Psd = 0.04 G2/hz
1000 Hz To 2000 Hz Psd Decreasing At 6 Db/octave

Vibration Class V3
1 Hour Per Axis:
5 Hz To 100 Hz Psd Increasing At 3 Db/octave
100 Hz To 1000 Hz Psd = 0.1 G2/hz
1000 Hz To 2000 Hz Psd Decreasing At 6 Db/octave

Module Operating Temperature:

Air-cooled
Min/Max
Inlet Air
Class Temperature
Ac1,fc1 0°c 55°c
Ac2,fc2 -40°c 55°c
Ac3,fc3 -40°c 70°c
Ac4,fc4 -55°c 85°c

Conduction-Cooled
Class Min/max
Cc1 0°c 55°c
Cc2 -40°c 55°c
Cc3 -40°c 70°c
Cc4 -40°c 85°c

Liquid-Cooled
Inlet Outlet
Class Min/max
Lc1 0°c 50°c
Lc2 -40°c 50°c
Lc3 -40°c 60°c
Lc4 -40°c 70°c

Module Physical Dimensions

3U Module Dimensions:
3.94ʺ X 6.30” Or 5HP

6U Module Dimensions:
9.187ʺ X 6.30” Or 5HP

Glossary of Terminology

RDK

Rugged Development Kit – WaveTherm develops products which are called RDK's or rugged development kits. WaveTherm's RDK’s comprise of mechanical parts and knowledge-based instructions for how a computer manufacturer can develop products intended for use in harsh environments.

TR𝜇COTS™

Tr𝜇COTS™ – WaveTherm offers a product line for MicroTCA applications which is called Tr𝜇COTS. These products target off the shelf AMC modules for ruggedization.

OpenCOTS™

OpenCOTS™ – WaveTherm offers a product line for VPX, OpenVPX, VME, and cPCI applications which is called OpenCOTS™. These products target manufacturers of single-board computer manufacturers who may desire a standard products-based approach to rugged SBC product development.

CCA

CCA or circuit card assembly is a mechanical assembly used to compliment an electronic assembly in a conduction-cooled applications.

Conduction-Cooling

The transfer of heat by molecular motion from a source of high temperature to a region of lower temperature, tending toward a result of equalized temperatures.

Rugged Air-Cooled

An electronic assembly secured to withstand various shock and vibration levels which is thermally cooled by forced-air or natural convection.

Hybrid Cooling

An electronic assembly which is cooled simultaneously by conduction-cooling and forced-air or natural convection methods.

Thermal Analysis

Thermal Analysis – WaveTherm has modeled, simulated, and tested many of its products contained in this website. We also offer simulation services to customers which design their own products or variations of our base products. Simulations can be accomplished for board-level single-board computers, and/or system-level enclosures/chassis. Simulations we support are FEA – Finite Element Analysis and CFD – Computational Fluid Dynamics analysis.

Heatframe Design Knowledge

Primary vs Secondary Side SOLIDWEDGE™ 

Can the hole in the middle of the reference design be moved/removed?

Yes. The center hole in the PCB reference designs can be moved or removed without harming the viability of fielding a ruggedized module.